LED SMD vs COB vs GOB

   With the development of the LED display industry, a variety of packaging processes have emerged in succession. From the previous DIP process,to the surface mount (SMD) process, to the COB packaging technology, and finally to the GOB packaging technology, During the development of the small-pitch manufacturing process, many LED manufacturers have made every effort to achieve better solutions for small-pitch displays.

   SMD (Surface Mount Technology) packaged LED products are made of lamp beads of different specifications, which are soldered to the circuit board by high-speed reflow soldering at high temperature using a high-speed chip mounter, to make display units with different pitches.Small pitch SMD products generally expose the LED lamp beads and then add a mask.Due to its mature and stable technology, low manufacturing cost, good heat dissipation, and simple maintenance, it also occupies a large share in the LED application market. But it also has the following defects:

1.Low protection level

》》 It does not have the characteristics of moisture-proof, waterproof, dust-proof, shock-proof and anti-collision. In humid climates, large batches of dead and bad lights are prone to occur; during the transportation process, led lamps are easy drop and get damaged;Dead light phenomenon is easily caused by the influence of static electricity

2, great damage to the eyes

》》 Long-term viewing will cause glare and fatigue. In addition, there is a "blue harm" effect. Because blue LEDs have short wavelengths and high frequencies, human retinas are prone to lesions when directly exposed to blue light for a long time.

3.Short life of LED lights

》》 The life of the lamp will be greatly shortened by environmental factors.The PCB circuit board has copper ion migration due to environmental factors, and a micro-short phenomenon occurs.

4.Mask problems

》》The mask used in the small pitch SMD LED module is easy to swell in high temperature environment, which affects the viewing effect.In addition, after using the LED screen for a period of time, because the mask cannot be washed, it will cause whitening or yellowing, which will not only cause an unsightly appearance, but also affect viewing.

The full name of COB packaging technology is Chips on Board, which is a technology to solve the problem of LED heat dissipation.   Compared with DIP and SMD, it is characterized by saving space, simplifying packaging operations, and has an efficient thermal management method. COB has certain advantages in terms of manufacturing efficiency, low thermal resistance, light quality, application, and cost. However, as a new technology,

COB has insufficient accumulation in the small pitch LED industry, the process needs to be improved, and the major products in the market have

disadvantages such as high cost.

1.Poor color consistency "Because no lights are selected, it is impossible to separate light and color, and poor consistency.

2. Poor surface flatness "Because it is a single lamp dispensing, the flatness is poor, and the graininess is obvious to the touch.

3. Difficulty of maintenance "Because professional equipment is required, maintenance is difficult and the cost of maintenance is high. Generally, it must be returned to the factory for maintenance.

4. High manufacturing cost "Due to the high defect rate, the manufacturing cost is much higher than the small pitch of SMD.

GOB (Glue on board) packaging technology is to solve the protection problem of LED lamp.It uses an advanced new transparent material to

package the substrate and its LED packaging unit, thereby forming effective protection. This material not only has super high transparency, but also has super thermal conductivity. The GOB small pitch can be adapted to any harsh environment.Compared with the traditional SMD process, it has the characteristics of high protection, moisture resistance, water resistance, anti-collision, and UV resistance.It can be used in more harsh environments to avoid large-scale dead lights and light off;compared with the COB process, it has   simpler maintenance,lower maintenance costs,and a larger viewing angle. It can solve problems such as COB's inability to mix lamps, serious modularity, poor spectroscopic separation, and poor surface flatness. But because it uses the entire surface of the glue, often the picture is not clear.